Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...