No longer confined within the orderly, climate-controlled walls of datacentres, physical AI must be engineered – from silicon ...

Key market opportunities in agentic AI in digital engineering include the need for faster innovation, managing complexity, and harnessing rapid AI advancements. Growth is spurred by integration with ...

A case study in aerospace manufacturing provides an overview of how physics-informed digital twin systems transform robotics processes—from adaptive process planning and real-time process monitoring ...

Scandiano, September 3, 2025 – E4 Computer Engineering, an Italian company in the field of high-tech hardware and software solutions for high-performance computing, artificial intelligence, and ...

Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across ...

To unleash the full potential of photonic quantum technologies we are urged to miniaturize and integrate our systems. One crucial building block is quantum light sources. Prof. Dr Klaus Jöns will ...

The idea that more functionality can be added into a single chip, or even into a single system, is falling out of vogue. For an increasing number of applications, it’s no longer considered the best ...