At this week's HotChips 34 conference, Intel CEO Pat Gelsinger laid out his company's vision for the future, and a cornerstone of that vision is advanced packaging combining multiple chiplets. That's ...
Intel Corp. has unveiled a new transistor dielectric material that it says will boost performance and dramatically reduce current leakage in next-generation chips. The advancement could enable Intel ...
At the 2026 VLSI Symposium, Intel Foundry provided an update on its process roadmap and long-term innovation investments. It shared that Intel 18A-P, the first performance enhancement in the Intel 18A ...
Intel Wednesday demonstrated its revolutionary three-dimensional (3-D) Tri-Gate transistor technology in a 22-nm microprocessor, code-named Ivy Bridge, that is already being used in prototype laptops, ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
Intel is in production with several 65-nm processors now, creating an inventory of commercial microprocessor products that will begin shipping early next year. At the IEDM conference, Intel showed die ...
SAN FRANCISCO -- Intel Corp. said Wednesday that it has redesigned the electronic switches on its chips so that computers can keep getting cheaper and more powerful. The switches, known as transistors ...
A SemiAnalysis teardown shows SMIC’s N+3 process beats Intel 18A in metal pitch, but Intel still leads in density and ...
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