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Utilising Infineon's improved .XT die attach interconnection technology, the G2 devices achieve more than 15 percent lower ...
These support Mode 3 charging, which stipulates built-in control and protection functions for safety, and can charge an EV at ...
Rutronik expands franchise portfolio to include Axelera AI, European pioneer in the field of AI inference at the edge.
Renesas' 64-bit RZ/G3E MPU has been optimised for high-performance Human Machine Interface (HMI) applications.
SiMa.ai, a developer of a MLSoC platform, has announced the next phase of its strategic collaboration with Synopsys.
Arm CEO Rene Haas has revealed that the company is stepping up investment in chiplets and solutions development.
European electronic components distribution market has yet to show any clear signs of recovery according to DMASS.
The new 9th generation BiCS FLASH 512Gb TLC, developed using a 120-layer stacking process based on 5th generation BiCS FLASH ...
Moxa Europe achieves EU type-examination certification under Radio Equipment Directive Delegated Act (RED-DA).
Korean and US memory suppliers are to significantly reduce or even cease production of LPDDR4X in 2025 and 2026.
Brazilian operator Revo signed up for 50 of Eve Air Mobility’s four-passenger planes. Like competitors Bell Textron, Joby ...
NC State University researchers demonstrate a spectrometer that is orders of magnitude smaller than existing devices.
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